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XC3S700A-4FGG400I Xilinx FPGA Field Programmable Gate Array Spartan-3A Series 700K Gates 400-FBGA Package
Number of LABs/CLBs | 1472 | |
Number of Logic Elements/Cells | 13248 | |
Total RAM Bits | 368640 | |
Number of I/O | 311 | |
Number of Gates | 700000 | |
Voltage - Supply | 1.14V ~ 1.26V | |
Mounting Type | | |
Operating Temperature | -40°C ~ 100°C (TJ) | |
Package / Case | | |
Supplier Device Package | 400-FBGA (21x21) |
Product: XC3S700A-4FGG400I Programmable IC Chip
Specifications:
- Family: Spartan-3A
- Device: XC3S700A
- Speed Grade: -4
- Package: FGG400
- I/O Pins: 400
- Logic Cells: 69,120
- Slices: 4,320
- Block RAM: 1,152 Kb
- DSP48E1 Slices: 90
- Clock Management Tiles: 2
- Total RAM Bits: 1,179,648
- Operating Voltage: 1.14V - 1.26V
- Operating Temperature: -40°C to +100°C
Features:
- High-performance, low-power FPGA (Field-Programmable Gate Array)
- Optimized for a wide range of applications
- Supports high-speed communication and processing requirements
- Industry-standard core voltages for efficient power consumption (1.14V - 1.26V)
- Large logic capacity with 69,120 logic cells
- Abundant I/O pins (400) for versatile connectivity options
- Integrated memory blocks (1,152 Kb) for efficient data storage
- DSP resources (90 slices) for digital signal processing
- Advanced clock management tiles (2) for precise timing control
- Wide operating temperature range for various environments
- Supports advanced design methodologies and tool flows
Package Details:
- Package Type: FGG400
- Pin Count: 400
- Pin Pitch: 0.8mm
- Package Dimensions: 23mm x 23mm
- RoHS compliant