Shenzhen Sai Collie Technology Co., Ltd.

Shenzhen Sai Collie Technology Co., Ltd.

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XC2S200-5FGG456C Xilinx FPGA Field Programmable IC Chip High Performance

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Country/Region:china
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XC2S200-5FGG456C Xilinx FPGA Field Programmable IC Chip High Performance

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Brand Name :XILINX / AMD
Model Number :XC2S200-5FGG456C
Place of Origin :original
MOQ :1
Price :Negotiable
Payment Terms :L/C, D/A, D/P, T/T, Western Union, MoneyGram
Supply Ability :999999
Delivery Time :1-3 days
Packaging Details :standard
Number of LogNumber of LABs/CLBs :1176
Total RAM Bitsage (Vdss) :57344
Number of I/ODrain (Id) @ 25°C :284
Voltage - Supplyds On, Min Rds On) :2.375V ~ 2.625V
Operating Temperature :0°C ~ 85°C (TJ)
Mounting Type :Surface Mount
PN :XC2S200-5FGG456C
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XC2S200-5FGG456C Xilinx FPGA Field Programmable Gate Array Spartan-II Series 200K Gates 456-FBGA Package

Number of LABs/CLBs
1176
Number of Logic Elements/Cells
5292
Total RAM Bits
57344
Number of I/O
284
Number of Gates
200000
Voltage - Supply
2.375V ~ 2.625V
Mounting Type
Operating Temperature
0°C ~ 85°C (TJ)
Package / Case
Supplier Device Package
456-FBGA (23x23)

Product Listing: Programmable IC Chip - XC2S200-5FGG456C

Product Name: Programmable IC Chip - XC2S200-5FGG456C

Product Description: The Programmable IC Chip - XC2S200-5FGG456C is a versatile and high-performance integrated circuit designed for programmable logic applications. It offers a wide range of features and capabilities, making it suitable for various electronic projects and designs that require flexibility and efficient processing.

Product Specifications:

  • Model: XC2S200-5FGG456C
  • Package Type: 456-pin Fine-pitch Ball Grid Array (FGG456)
  • Manufacturer: Xilinx
  • Operating Temperature: -40°C to 85°C
  • Logic Cells: 2,000
  • Maximum User I/O Pins: 300
  • Block RAM: 144 Kbits
  • Clock Management Tiles: 4
  • JTAG Boundary Scan Support: Yes
  • Configuration Memory: Non-volatile Flash
  • Power Supply Voltage: 1.8V core voltage, 3.3V I/O voltage

Key Features:

  • Versatile and efficient programmable logic device
  • Fine-pitch Ball Grid Array (FGG456) package for compact integration
  • Ample logic cells for various design and computation requirements
  • Sufficient I/O pins for versatile connectivity options
  • Adequate block RAM for data storage and processing needs
  • Clock management tiles for precise timing control
  • JTAG boundary scan support for easy debugging and testing
  • Non-volatile flash memory for secure and reliable configuration storage
  • Wide operating temperature range for different environments
  • Low power consumption for energy-efficient designs

Applications:

  • Embedded systems and microcontroller applications
  • Industrial automation and control systems
  • Robotics and motor control applications
  • Data acquisition and control systems
  • Communication and networking devices
  • Automotive electronics
  • Test and measurement equipment
  • Consumer electronics

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How to buy >>>
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Service >>>
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XC2S200-5FGG456C Xilinx FPGA Field Programmable IC Chip High Performance

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