XC3S1000-4FTG256I Field Programmable Gate Array (FPGA) IC Chip 676-FBGA Package Low-cost high-performance
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Product Listing: Programmable IC Chip - XC3S1000-4FTG256I
Product Name: Programmable IC Chip - XC3S1000-4FTG256I
Product Description: The Programmable IC Chip - XC3S1000-4FTG256I is a versatile integrated circuit designed for programmable logic applications. It offers high performance and flexibility, making it ideal for a wide range of electronic projects and designs.
Product Specifications:
- Model: XC3S1000-4FTG256I
- Package Type: 256-pin Fine-pitch Thin Quad Flat Pack (FTG256)
- Manufacturer: Xilinx
- Operating Temperature: -40°C to 100°C
- Logic Cells: 1,008
- Maximum User I/O Pins: 178
- Block RAM: 16,320 bits
- DSP Slices: 4
- Clock Management Tiles: 2
- JTAG Boundary Scan Support: Yes
- Configuration Memory: Non-volatile Flash
- Power Supply Voltage: 1.2V core voltage, 3.3V I/O voltage
Key Features:
- High-performance programmable logic device
- Fine-pitch Thin Quad Flat Pack (FTG256) package for compact integration
- Abundant logic cells for complex designs
- Versatile I/O pins for flexible connectivity
- Ample block RAM for data storage and processing
- Dedicated DSP slices for signal processing tasks
- Clock management tiles for precise timing control
- JTAG boundary scan support for easy debugging and testing
- Non-volatile flash for secure configuration storage
- Wide operating temperature range for various environments
- Low power consumption for energy-efficient designs
Applications:
- Embedded systems and microcontrollers
- Communication and networking equipment
- Industrial automation and control systems
- Test and measurement instruments
- Audio and video processing systems
- Robotics and motion control systems
- Medical devices and equipment
- Automotive electronics and infotainment systems
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