XC7S75-1FGGA676Q Field Programmable Gate Array (FPGA) IC Chip Package 676-BGA
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Product Listing: Programmable IC Chip - XC7S75-1FGGA676Q
Product Name: Programmable IC Chip - XC7S75-1FGGA676Q
Product Description: The Programmable IC Chip - XC7S75-1FGGA676Q is a high-performance integrated circuit designed for programmable logic applications. It offers advanced features and capabilities, making it suitable for a wide range of electronic projects and applications.
Product Specifications:
- Model: XC7S75-1FGGA676Q
- Package Type: 676-pin Fine-pitch Ball Grid Array (FGGA676)
- Manufacturer: Xilinx
- Operating Temperature: -40°C to 100°C
- Logic Cells: 75,000
- Maximum User I/O Pins: 350
- Block RAM: 4,860 Kbits
- DSP Slices: 240
- Clock Management Tiles: 6
- JTAG Boundary Scan Support: Yes
- Configuration Memory: Non-volatile Flash
- Power Supply Voltage: 1.2V core voltage, 3.3V I/O voltage
Key Features:
- High-performance programmable logic device
- Fine-pitch Ball Grid Array (FGGA676) package for compact integration
- Abundant logic cells for complex designs
- Extensive I/O pins for versatile connectivity
- Large block RAM for data storage and processing
- Dedicated DSP slices for demanding signal processing tasks
- Multiple clock management tiles for precise timing control
- JTAG boundary scan support for easy debugging and testing
- Non-volatile flash for secure configuration storage
- Wide operating temperature range for various environments
- Low power consumption for energy-efficient designs
Applications:
- High-speed data processing and networking applications
- Digital signal processing and multimedia systems
- Industrial automation and control systems
- Aerospace and defense electronics
- Test and measurement instruments
- Medical devices and equipment
- Telecommunications and networking equipment
- Automotive electronics and infotainment systems
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