5CEBA4F23C7N Programmable IC Chip
Field Programmable Gate Array (FPGA) IC 224 3464192 49000 Package 484-BGA
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• TSMC's 28-nm low-power (28LP) process technology
• 1.1 V core voltage
• Wirebond low-halogen packages
• Multiple device densities with compatible package footprints for seamless migration between
different device densities
• RoHS-compliant and leaded(1)options
• M10K—10-kilobits (Kb) memory blocks with soft error correction code (ECC)
• Memory logic array block (MLAB)—640-bit distributed LUTRAM where you can use up to 25% of the ALMs as MLAB memory
• Up to 550 MHz global clock network
• Global, quadrant, and peripheral clock networks
• Clock networks that are not used can be powered down to reduce dynamic power
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