Shenzhen Sai Collie Technology Co., Ltd.

Shenzhen Sai Collie Technology Co., Ltd.

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SN74LVC1G332DCKR Integrated Circuit Chip OR Gate IC 1 Channel Logic Gates Single

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Shenzhen Sai Collie Technology Co., Ltd.
City:shenzhen
Country/Region:china
Contact Person:DANDAN
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SN74LVC1G332DCKR Integrated Circuit Chip OR Gate IC 1 Channel Logic Gates Single

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Brand Name :TI
Model Number :SN74LVC1G332DCKR
Place of Origin :original
MOQ :1
Price :Negotiable
Payment Terms :L/C, D/A, D/P, T/T, Western Union, MoneyGram
Supply Ability :999999
Delivery Time :1 - 3 days
Packaging Details :standard
Number of Circuits :1
Operating Temperature :-40°C ~125°C
Voltage - Supply :1.65V ~ 5.5V
Mounting Type :Surface Mount
Package / Case :6-TSSOP, SC-88, SOT-363
Supplier Device Package :SC-70-6
PN :SN74LVC1G332DCKR
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SN74LVC1G332DCKR Integrated Circuit

IC Chip OR Gate IC 1 Channel Logic Gates Single 3 Input Package SC-70-6

SN74LVC1G332DCKR

Logic Type
Number of Circuits
1
Number of Inputs
3
Features
-
Voltage - Supply
1.65V ~ 5.5V
Current - Quiescent (Max)
10 µA
Current - Output High, Low
32mA, 32mA
Input Logic Level - Low
0.7V ~ 0.8V
Input Logic Level - High
1.7V ~ 2V
Max Propagation Delay @ V, Max CL
4.5ns @ 5V, 50pF
Operating Temperature
-40°C ~ 125°C
Mounting Type
Supplier Device Package
Package / Case
6-TSSOP, SC-88, SOT-363
Base Product Number

SN74LVC1G332DCKR Features

  • Available in the Texas Instruments NanoStar and NanoFree Packages
  • Supports 5-V VCC Operation
  • Inputs Accept Voltages to 5.5 V
  • Supports Down Translation to VCC
  • Max tpd of 4.5 ns at 3.3 V
  • Low Power Consumption, 10-µA Max ICC
  • ±24-mA Output Drive at 3.3 V
  • Ioff Supports Live Insertion, Partial-Power-Down Mode, and Back-Drive Protection
  • Latch-Up Performance Exceeds 100 mA Per
  • JESD 78, Class II
  • ESD Protection Exceeds JESD 22
  • 2000-V Human-Body Model (A114-A)
  • 200-V Machine Model (A115-A)
  • 1000-V Charged-Device Model (C101)


SN74LVC1G332DCKR Description

The SN74LVC1G332DCKR device performs the Boolean function in positive logic.


NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.


This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

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SN74LVC1G332DCKR Integrated Circuit Chip OR Gate IC 1 Channel Logic Gates Single

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